Three dimensional integrated circuit and method for controlling the same

摘要

A three dimensional integrated circuit includes a master circuit, a slave circuit, and a through-silicon via (TSV). The master circuit is configured to receive and process an input data, a data strobe signal (DQS) and an input command to output a writing data signal to a master die. The through-silicon via (TSV) is electrically coupled between the master circuit and the slave circuit. The master circuit is configured to transfer the writing data signal to a slave die through the TSV. Furthermore, a method for controlling a three dimensional integrated circuit is disclosed herein.

主权项

1. A three dimensional integrated circuit, comprising:
a master circuit configured to receive and process an input data, a data strobe signal (DQS) and an input command to output a writing data signal to a master die, wherein the master circuit comprises:
a latch circuit configured to receive the input data and the DQS and output a data signal based on the input data and the DQS;a serial to parallel data conversion circuit configured to convert the data signal from a serial data into a parallel data;a command decoder configured to decode the input command and output a command signal;a writing command controller configured to receive and process the command signal to output a write control signal;a writing timing generation circuit configured to receive and process the write control signal and the DQS to output a data release signal; anda data driver configured to receive and process the data signal and the data release signal to output the writing data signal to the master die; a slave circuit; and a through-silicon via (TSV) electrically coupled between the master circuit and the slave circuit; wherein the master circuit is configured to transfer the writing data signal to a slave die through the TSV.