Optical device and method for manufacturing same

摘要

The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate.

主权项

1. A metal substrate for an optical device comprising:
a metal plate having a top surface and a bottom surface and including a plurality of metal portions; a plurality of insulation regions, each passing vertically through the thickness of the metal plate; a plurality of light emitting chips disposed on a plurality of the metal portions; and a barrier that defines a region including a plurality of the metal portions and a plurality of the insulation regions; wherein the plurality of the metal portions are separated by the plurality of the insulation regions, wherein a plurality of the light emitting chips are electrically connected in parallel along the insulation regions and a plurality of the light emitting chips are electrically connected in series along an orthogonal direction of the insulation regions.