Semiconductor apparatus having signal and ground terminals arranged on vertically adjacent wiring substrates

摘要

A semiconductor apparatus includes a first wiring substrate, a second wiring substrate positioned above the first wiring substrate, multiple connection terminals provided between the first wiring substrate and the second wiring substrate and configured to electrically connect the first wiring substrate and the second wiring substrate, an electronic component provided on at least one of the first wiring substrate and the second wiring substrate. The multiple connection terminals include a signal terminal and ground terminals provided on both sides of the signal terminal. The signal terminal and the ground terminals have side surfaces that face each other. The signal terminal and the ground terminals are adjacently arranged, so that intervals between the side surfaces of the signal terminal and the ground terminals are constant from a plan view.

主权项

1. A semiconductor apparatus comprising:
a first wiring substrate; a second wiring substrate positioned above the first wiring substrate; a plurality of connection terminals provided between the first wiring substrate and the second wiring substrate and configured to electrically connect the first wiring substrate and the second wiring substrate; and an electronic component provided on the first wiring substrate and the second wiring substrate; wherein the plurality of connection terminals include a signal terminal and ground terminals provided on both sides of the signal terminal, wherein the signal terminal and the ground terminals have side surfaces that face each other, wherein the signal terminal and the ground terminals are adjacently arranged, so that intervals between the side surfaces of the signal terminal and the ground terminals are constant from a plan view, wherein the plurality of connection terminals have a resilient property.