EPOXY RESIN COMPOSITION FOR SEALING

摘要

EPOXY RESIN COMPOSITION FOR SEALING An epoxy resin composition for sealing is here disclosed which is characterized by comprising a composition (A) comprising an epoxy resin, a curing agent and an inorganic filler and a graft copolymer (B) obtained by graft polymerizing 65 to 15 parts by weight of a monomer mixture (b) comprising a vinyl monomer containing an alkyl methacrylate ester as an essential component in the presence of a latex containing 35 to 85 parts by weight of a rubber polymer obtained by the emulsion polymerization of a monomer mixture (a) comprising 50% by weight or more of a diene monomer and the residual percent of a copolymerizable vinyl monomer, at least one of the monomer mixture (a) and the monomer mixture (b) containing 0.05 to 20% by weight of a polyfunctional monomer. This epoxy resin composition exhibits low stress, and it is excellent in humidity resistance, heat cycle test resistance, moldability and dispersibility and is suitable for use in electronic and electrical parts.