| 摘要 |
The package structure has a self-alignment effect to omit the need of accurate alignment, and reduces the cost of manufacturing. The method includes the steps of: forming a drive metalization layer (21) and a chrome layer (22) on a TFT glass (2); forming a ball type solder (20), an alignment process, a joining process, and an encapsulation process. A TFT glass (2) forms a chrome layer (22) to prevent the overflow of solder (20). A bond pad (1a) of LCD driver chip (1") forms a Cr/Cu/Au metalization layer (23) to selectively form solder (20).
|
