蒸镀装置及蒸镀方法;DEPOSITION DEVICE AND DEPOSITION METHOD

摘要

本发明之蒸镀装置(100)包含：第一移动装置(130)，其系于蒸镀遮罩(120)与基板(50)分离之状态下，于平行于一面(51)之方向上，使蒸镀遮罩(120)与基板(50)之相对位置阶梯状地变化；及间隙调整装置(140)，其系于藉由第一移动装置(130)进行之蒸镀遮罩(120)与基板(50)之相对移动开始前，使蒸镀遮罩(120)与基板(50)于相互分离之方向上相对移动，而调整蒸镀遮罩(120)与基板(50)之间之间隙，并且，于藉由第一移动装置(130)进行之蒸镀遮罩(120)与基板(50)之相对移动停止时，使蒸镀遮罩(120)与基板(50)于相互接近之方向上相对移动，而调整蒸镀遮罩(120)与基板(50)之间之上述间隙。; and a gap adjustment device (140) which makes the deposition mask (120) and the substrate (50) relatively move toward a direction that the deposition mask (120) and the substrate (50) are distant each other before a relative movement of the deposition mask (120) and the substrate (50) by the first movement device (130) starts, adjusts a gap between the deposition mask (120) and the substrate (50), makes the deposition mask (120) and the substrate (50) move toward a direction that the deposition mask (120) and the substrate (50) are close to each other, and adjusts the gap between the deposition mask (120) and the substrate (50) ina case that the relative movement of the deposition mask (120) and the substrate (50) by the first movement device (130) is stopped.