摘要 |
用于制造热敏性黏着剂,特别是薄纱、膜、颗粒、纤丝、格栅、粉末、或悬浮体之组成物,其包含(以重量为基准计,总计等于100%):- 98%至100%的至少一种带有醯胺单元与聚醚单元的共聚醯胺,其具有约90至约150℃,特别是约100至约125℃之熔点(Tm)与根据ISO 178(2010)标准所测定之少于100MPa的挠曲模数;- 0至2%的至少一种选自安定剂或染料或彼等之混合物的添加剂。 Composition comprising, on a weight basis, the total being equal to 100%: - from 98% to 100% of at least one copolyamide bearing amide units and polyether units, having a melting point (Tm) from about 90 to about 150℃, in particular from about 100℃; - from 0 to 2% of at least one additive chosen from stabilizers and dyes, or a mixture thereof, for the manufacture of a heat-sensitive adhesive, in particular a veil, a film, granules, a filament, a grate, a powder or a suspension. |