| 发明名称 |
A selective plating method of manufacturing high aspect ratio plated-through-hole printed circuit boards with solder-mask on bare copper conductors and a printed circuit board manufactured thereby |
| 摘要 |
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| 申请公布号 |
IN174070(B) |
申请公布日期 |
1994.09.10 |
| 申请号 |
IN1990MA17119 |
申请日期 |
1990.03.08 |
| 申请人 |
MICROPACK LIMITED |
发明人 |
MITTER VEDU;UMANATH COIMBATORE RAJAGOPAL |
| 分类号 |
H05K3/00;(IPC1-7):H05K3/00 |
主分类号 |
H05K3/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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