| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a forming method of an adhesive layer, by which a thin film adhesive layer is formed in a suitable position and shape while suppressing damage of an adherend, and the adhesive layer for suppressing generation and remaining of a void in an interface or inside is formed, while suppressing displacement of the adherend at the time of adhesion. <P>SOLUTION: The forming method of the adhesive layer includes: an adhesive layer forming step of selectively applying the adhesive composition containing a thermosetting component and an organic solvent on an adhesive surface by using a non-contact type applying device; and a solvent removing step of removing the solvent from the adhesive composition applied on the adhesive surface. The adhesive composition contains 1 to 20 mass% of an inorganic filler in which an average particle diameter is 1 to 200 nm. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
