| 摘要 |
The invention relates to a method of heat transfer in power electronics applications is disclosed, wherein a metal foil comprising at least about 50% of tin, based on a total amount of metals contained in the metal foil, is used as a thermal interface material between a base plate of a heat-generating component and a heat sink. The invention also relates to a method for producing a power electronics assembly, comprising the steps of: disposing a metal foil comprising at least about 50% of tin, based on a total amount of metals contained in the metal foil on a heat sink; disposing a base plate of a heat generating component or module on the heat sink covered by the metal foil to provide a power electronics device; applying a clamping force to the power electronics assembly to provide a cooled power electronics assembly. |
