CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, ENCAPSULANT, AND SEMICONDUCTOR DEVICE

摘要

PROVIDED IS A CURABLE RESIN COMPOSITION CAPABLE OF FORMING A CURED PRODUCT THAT HAS EXCELLENT HEAT RESISTANCE AND TRANSPARENCY AND, IN PARTICULAR, OFFERS EXCELLENT BARRIER PROPERTIES TO A CORROSIVE GAS. THE CURABLE RESIN COMPOSITION ACCORDING TO THE PRESENT INVENTION INCLUDES A POLYORGANOSILOXANE (A), AN ISOCYANURATE COMPOUND (B), AND A SILANE COUPLING AGENT (C). THE POLYORGANOSILOXANE (A) IS AN ARYL-CONTAINING POLYORGANOSILOXANE. THE POLYORGANOSILOXANE (A) PREFERABLY INCLUDES A POLYORGANOSILOXANE HAVING A NUMBER-AVERAGE MOLECULAR WEIGHT (MN) OF 500 TO 4000 AS DETERMINED BY GEL PERMEATION CHROMATOGRAPHY AND CALIBRATED WITH A POLYSTYRENE STANDARD. NO