发明名称 CONDUCTIVE SILVER PASTE FOR A METAL-WRAP-THROUGH SILICON SOLAR CELL
摘要 <p>A conductive silver via paste comprising particulate conductive silver, a vanadium-phosphorus-antimony-zinc-based-oxide, a tellurium-boron-phosphorus-based-oxide or a tellurium-molybdenum-cerium-based-oxide and an organic vehicle is particularly useful in providing the metallization of the holes in the silicon wafers of MWT solar cells. The result is a metallic electrically conductive via between the collector lines on the front side and the emitter electrode on the back-side of the solar cell. The paste can also be used to form the collector lines on the front-side of the solar cell and the emitter electrode on the back-side of the solar cell. Also disclosed are metal-wrap-through silicon solar cells comprising the fired conductive silver paste.</p>
申请公布号 EP2954535(A2) 申请公布日期 2015.12.16
申请号 EP20140705658 申请日期 2014.02.04
申请人 E. I. DU PONT DE NEMOURS AND COMPANY 发明人 HANG, KENNETH, WARREN;WANG, YUELI
分类号 H01B1/02;H01B1/22;H01L31/00 主分类号 H01B1/02
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