| 摘要 |
<p>The module (M) has outer connecting pads (30) arranged on an upper face of a support, and inner connecting pads (40) arranged on a lower surface of the support. An integrated circuit (200) is housed in a layer of the support, and is housed in an open cavity on the lower face of the support. The inner connecting pads are arranged on a periphery of the cavity, where the support is realized in a single piece. The support is formed of an upper support and a lower support assembled with one another. Independent claims are also included for the following: (1) a chip card including a card body having shape adapted for receiving a module and including an intermediate functional layer that is a metallic layer (2) a method for fabrication of a chip card.</p> |
