薄型化晶片之封装结构其及制造方法;PACKAGING STRUCTURE FOR THINNED WAFER AND METHOD FOR MANUFACTURING THE SAME

摘要

本发明提出一种薄型化晶片之封装结构，包含一基板、一薄型化晶片、一强化层及一密封胶体。薄型化晶片设置于基板上且与基板电性连接；强化层设置于该薄型化晶片上；密封胶体形成于基板上且包覆薄型化晶片及强化层。强化层承受形成密封胶体的压力或应力，以保护薄型化晶片。本发明另提出一种薄型化晶片之封装结构的制造方法，其可制造上述薄型化晶片之封装结构。; the strengthen layer is disposed on the thin die; the encapsulation body is formed on the substrate and covers both the thin die and the strengthen layer. The strengthen layer can bear the pressure or stress during the formation of the encapsulation body to protect the thin die. A method for manufacturing a packaging structure for thin die is further provided to manufacture the above packaging structure for thin die.