半导体封装件及其制法;SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURE

摘要

一种半导体封装件及其制法，该半导体封装件包括基板、至少一电子元件与封装胶体，该电子元件系接置且电性连接于该基板上，该封装胶体系形成于该基板上，且包覆该电子元件，且该封装胶体系包括：占该封装胶体总重5至10重量%之环氧树脂；占该封装胶体总重1至5重量%之酚树脂；占该封装胶体总重65至75重量%之氧化铁；占该封装胶体总重5至30重量%之二氧化矽；以及占该封装胶体总重0.1至1重量%之碳黑，藉此有效改善电磁干扰问题。; a phenolic occupying 1-5 % of the total weight of the encapsulant; an oxide iron occupying 65-75% of the total weight of the encapsulant; a silica occupying 5-30 % of the total weight of the encapsulant; and a carbon black occupying 0.1-1% of the total weight of the encapsulant, thereby effectively improving on the problem of electromagnetic interference.