| 摘要 |
A device for the thermal bonding of a flexible covering (13) to a support (12), using a fluidized bed of particles (4), includes an internal zone, called a heating box (10) smaller in size than that of the enclosure (2), which is placed approximately at the center of the latter, the heating box having a gas distributor (6b), a diffusion mesh (7b) and a gas feed system (5b, 9) that are separate and isolated from those of the enclosure, and heating elements (11) designed to be placed in the particle bed. A thermal bonding method suitable for being implemented by this device is also described. |
