| 摘要 |
An embodiment of the present invention provides a light emitting device module which comprises: a circuit board including a first insulating layer, a conductive pattern on the first insulating layer, and a second insulating layer on the conductive pattern; and a light emitting device package which is electrically connected on the circuit board with a conductive adhesive, and includes a package body, a pair of lead frames, and a light emitting device electrically connected to the pair of lead frames. The second insulating layer on the circuit board is opened in an area in contact with the package body. |
