发明名称 Liquid droplet jetting apparatus
摘要 A liquid droplet jetting apparatus configured to jet liquid droplets, includes: a channel structure; an energy applying device including a plurality of first contact points; a wiring board arranged to face the surface of the energy applying device and connected to the energy applying device. The wiring board includes second contact points electrically connected to the first contact points, respectively and signal wiring lines connected to the second contact points, respectively. Further, the liquid droplet jetting apparatus includes a sealing material arranged, between the wiring board and the energy applying device, to surround at least a part of an area in which the first and second contact points are arranged, and a recess-protrusion portion formed in an area, of the wiring board, which is positioned between the sealing material and the second contact points, and which is other than an area in which the second contact points are arranged.
申请公布号 US9211709(B2) 申请公布日期 2015.12.15
申请号 US201314012356 申请日期 2013.08.28
申请人 Brother Kogyo Kabushiki Kaisha 发明人 Yamashita Toru;Kubo Tomoyuki;Kato Yasuhiro
分类号 B41J2/14;B41J2/16;B41J2/05 主分类号 B41J2/14
代理机构 Frommer Lawrence & Haug LLP 代理人 Frommer Lawrence & Haug LLP
主权项 1. A liquid droplet jetting apparatus configured to jet liquid droplets of a liquid, comprising: a channel structure in which a liquid channel including a plurality of nozzles is formed; an energy applying device which is configured to apply jetting energy for jetting the liquid droplets from the nozzles to the liquid in the liquid channel, and includes a plurality of first contact points disposed on a surface of the energy applying device; a wiring board arranged to face the surface of the energy applying device and connected to the energy applying device, including: a plurality of second contact points electrically connected to the first contact points of the energy applying device, respectively; anda plurality of signal wiring lines connected to the second contact points, respectively; a sealing material arranged, between the wiring board and the energy applying device, to surround at least a part of an area, of the wiring board, in which the first contact points and the second contact points are arranged; and a recess-protrusion portion formed in an area, of the wiring board, which is positioned between the sealing material and the second contact points and which includes at least one of a recessed portion and a protrusion portion; wherein the recess-protrusion portion is formed at least in part by a dummy wiring line which is not electrically connected to the second contact points and which protrudes toward the energy applying device; wherein the second contact points form a contact point array arranged in a first direction; and wherein the dummy wiring line includes: a first portion extending in a second direction intersecting the first direction at any one side in the first direction in which the contact point array extends; anda pair of second portions extending from the first portion along the first direction while sandwiching the contact point array.
地址 Aichi-ken JP