发明名称 |
Bi—Al—Zn—based Pb-free solder alloy |
摘要 |
A Pb-free solder alloy whose residual stress during solidification is small and which achieves high joint strength and high reliability, can suppress a reaction between Ni and Bi or diffusion of Ni when used to join Ni-containing electronic parts or substrates, and can withstand a high reflow temperature. A first aspect of a Pb-free solder alloy consists of 0.03% by mass or more but 0.70% by mass or less of Al, 0.2% by mass or more but 14.0% by mass or less of Zn, and the balance being Bi except for inevitable impurities. A second aspect of a Pb-free solder alloy consists of 0.03% by mass or ore but 0.70% by mass or less of Al, 0.2% by mass or more but 14.0% by mass or less of Zn, not more than 0.500% by mass of P, and the balance being Bi except for inevitable impurities. |
申请公布号 |
US9211614(B2) |
申请公布日期 |
2015.12.15 |
申请号 |
US201113702407 |
申请日期 |
2011.06.03 |
申请人 |
SUMITOMO METAL MINING CO., LTD. |
发明人 |
Iseki Takashi |
分类号 |
B23K35/26;B21C23/08;B23K35/02;B23K35/40;C22C12/00 |
主分类号 |
B23K35/26 |
代理机构 |
Kratz, Quintos & Hanson, LLP |
代理人 |
Kratz, Quintos & Hanson, LLP |
主权项 |
1. A Pb-free solder alloy, consisting of: between at least 0.03% by mass and at most 0.70% by mass of Al; between at least 0.2% by mass and at most 14.0% by mass of Zn; between 0.005% by mass and 0.500% by mass of P; and a balance being Bi except for inevitable impurities. |
地址 |
Tokyo JP |