Semiconductor chip including a spare bump and stacked package having the same

摘要

A stacked package including: a semiconductor substrate, a circuit layer formed over the semiconductor substrate, a bump formed over the circuit layer, a spare bump formed correspondingly to the bump and over the circuit layer, and configured for replacing the bump with the spare bump, a through electrode configuring to pass through the semiconductor substrate on a same line as the bump and electrically coupled the bump or the spare bump in response to a selection signal, and a spare through electrode configured to pass through the semiconductor substrate on a same line as the spare bump and electrically coupled with the bump or the spare bump in response to a selection signal. When a bump has failed, a vertical input/output line of the semiconductor chips is established by a spare bump corresponding to the failed bump through the selective signal routing.

主权项

1. A semiconductor chip, comprising:
a semiconductor substrate; a circuit layer formed over the semiconductor substrate; a bump formed over the circuit layer; a spare bump formed correspondingly to the bump and over the circuit layer, and configured for replacing the bump with the spare bump; a through electrode configured to pass through the semiconductor substrate on a same line as the bump and electrically couple with the bump or the spare bump in response to a selection signal; a spare through electrode configured to pass through the semiconductor substrate on a same line as the spare bump and electrically couple with the spare bump or the bump in response to the selection signal; a selection signal storage part configured for providing the selection signal; and a memory configured to store information on a fail bump, wherein the selection signal storage part sets the selection signals based on the stored fail bump information.