发明名称 |
Semiconductor light emitting device including GaAs substrate |
摘要 |
A semiconductor light emitting device including: a substrate made of GaAs; and a semiconductor layer formed on the substrate, in which part of the substrate on a side opposite to the semiconductor layer is removed by etching so that the semiconductor light emitting device has a thickness of not more than 60 μm. |
申请公布号 |
US9214603(B2) |
申请公布日期 |
2015.12.15 |
申请号 |
US201514603417 |
申请日期 |
2015.01.23 |
申请人 |
ROHM CO., LTD. |
发明人 |
Hosomi Tadahiro;Mineshita Kentaro |
分类号 |
H01L29/80;H01L31/112;H01L33/10;H01L33/30;H01L33/00;H01L33/46 |
主分类号 |
H01L29/80 |
代理机构 |
Rabin & Berdo, P.C. |
代理人 |
Rabin & Berdo, P.C. |
主权项 |
1. A semiconductor light emitting device, comprising:
a substrate made of GaAs; and a semiconductor layer formed on the substrate, wherein the semiconductor light emitting device has a thickness of not more than 60 μm, further wherein the semiconductor layer contains a first reflecting layer disposed on the substrate, a second reflecting layer disposed on the first reflecting layer, and an n-type clad layer disposed on the second reflecting layer, wherein the substrate is etched so that a thickness of the substrate in a stacking direction of the semiconductor light emitting device is reduced down to about 1 μm. |
地址 |
Kyoto JP |