Small form factor stacked electrical passive devices that reduce the distance to the ground plane

摘要

The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance to a ground plane. An array of capacitors can be formed by coupling a group of capacitors on their sides interspersed with interposer boards. The resulting configuration can increase component density and reduce an amount of resistance and effective series inductance between a set of power decoupling capacitors and an integrated circuit.

主权项

1. A capacitor array for mounting on a printed circuit board, the capacitor array comprising:
capacitors, wherein each capacitor of the capacitors includes:
(i) a transverse surface having a first terminal and a second terminal, and(ii) a dielectric material disposed between the first terminal and the second terminal; and an interposer board configured to extend perpendicular to the printed circuit board and contact each capacitor of the capacitors, wherein the interposer board includes opposing conductive surfaces in contact with co-planar first terminals of two of the capacitors to provide a conductive pathway between the co-planar first terminals.