Wiring board with built-in electronic component and method for manufacturing the same

摘要

A wiring board including a substrate having opening penetrating from first to second surfaces, an electronic component in the opening having first and second electrodes, a first insulation layer over the first surface, a second insulation layer over the second surface, a first via conductor in the first layer having bottom connected to the first electrode, a second via conductor in the first layer having bottom connected to the second electrode, a third via conductor in the second layer having bottom connected to the first electrode, and a fourth via conductor in the second layer having bottom connected to the second electrode. The first conductor is longer than the third conductor and has the bottom having greater width than the bottom of the third conductor, and the second conductor is longer than the fourth conductor and has the bottom having greater width than the bottom of the fourth conductor.

主权项

1. A wiring board, comprising:
a substrate having an opening portion penetrating from a first surface of the substrate to a second surface of the substrate on an opposite side with respect to the first surface of the substrate; an electronic component positioned in the opening portion and having a first side electrode and a second side electrode such that the first side electrode and the second side electrode extend from a first surface of the electronic component to a second surface of the electronic component on an opposite side with respect to the first surface of the electronic component; a plurality of insulation layers including a first insulation layer formed over the first surface of the substrate and the first surface of the electronic component and a second insulation layer formed over the second surface of the substrate and the second surface of the electronic component; and a plurality of via conductors including a first via conductor formed in the first insulation layer and having a bottom surface connected to the first side electrode, a second via conductor formed in the first insulation layer and having a bottom surface connected to the second side electrode, a third via conductor formed in the second insulation layer and having a bottom surface connected to the first side electrode, and a fourth via conductor formed in the second insulation layer and having a bottom surface connected to the second side electrode, wherein the first via conductor has a length which is set longer than a length of the third via conductor, the bottom surface of the first via conductor has a width which is formed greater than a width of the bottom surface of the third via conductor, the second via conductor has a length which is set longer than a length of the fourth via conductor, the bottom surface of the second via conductor has a width which is greater than a width of the bottom surface of the fourth via conductor, each of the first via conductor, the second via conductor, the third via conductor and the fourth via conductor is made of a filled plated material, each of the first via conductor, the second via conductor, the third via conductor and the fourth via conductor has a land portion having a recessed portion, the recessed portion of the third via conductor has a depth which is set smaller than a depth of the recessed portion of the first via conductor, and the recessed portion of the fourth via conductor has a depth which is set smaller than a depth of the recessed portion of the second via conductor.