Method of manufacturing light-emitting diode package

摘要

A method of manufacturing a light-emitting diode package is illustrated. A light-emitting diode chip is manufactured. A material layer is formed on side surfaces and a rear surface of the light-emitting diode chip. The material layer is then oxidized to convert the material layer into an oxidized layer to form a reflective layer on the side surfaces and the rear surface of the light-emitting diode chip. The light-emitting diode chip is packaged.

主权项

1. A method of manufacturing a light-emitting diode package, the method comprising:
dicing a wafer to obtain a light-emitting diode chip including side surfaces, a light-emitting surface, and a rear surface opposed to the light-emitting surface of the light-emitting diode chip; mounting the light-emitting diode chip on a carrier substrate, such that the light-emitting surface of the light-emitting diode chip is facing toward the carrier substrate; after mounting the light-emitting diode chip on the carrier substrate, forming a material layer on the side surfaces and the rear surface of the light-emitting diode chip; oxidizing the material layer to convert the material layer into an oxidized layer to form a reflective layer on the side surfaces and the rear surface of the light-emitting diode chip; and packaging the light-emitting diode chip.