Contact bumps methods of making contact bumps

摘要

Contact bumps between a contact pad and a substrate can include recesses and protrusions that can mate with the material of the substrate. The irregular mating surfaces between the contact bumps and the contact pads can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart cards.

主权项

1. A bump connection, comprising:
a contact pad,
wherein the contact pad comprises a lateral surface; a contact bump,
wherein the contact bump is coupled to the lateral surface,wherein the contact bump comprises a hollow space between a first surface and a second surface of the contact bump,wherein the first surface faces the second surface across the hollow space,wherein at least one of the first surface or second surface comprises a side surface,wherein the side surface has a recess or a protrusion, andwherein the second surface forms an angle with a direction perpendicular to the lateral surface.