Circuit stack structure

摘要

A circuit stack structure is provided. The circuit stack structure includes a conductor layer having metal wires arranged at intervals, propping portions respectively disposed in a gap between any two of the neighboring metal wires, and a protective layer covering the metal wires and the propping portions. The propping portions are electrically isolated with the metal wires. With supporting by the propping portions, all regions of a top surface of the protective layer corresponding to one of the propping portions are coplanar with all regions of the top surface of the protective layer corresponding to each of the metal wires.

主权项

1. A circuit stack structure disposed on an active component array substrate, comprising first areas and second areas which are alternatively arranged, wherein the circuit stack structure comprises:
a first conductor layer overlapped on a glass substrate of the active component array substrate, comprising a plurality of first metal wires arranged at intervals, wherein an area range of each first metal wire is consistent with an area range of each of the first areas, and an area range of a gap between any two adjacent first metal wires is consistent with an area range of the second area; a plurality of first propping portions respectively disposed in the second areas and electrically isolated with the first metal wires; and a protective layer covering the first conductor layer and the first propping portions, wherein at least with supporting by the first propping portions, top surfaces of the protective layer in the first areas are coplanar with top surfaces of the protective layer in the second areas.