| 发明名称 | Wiring substrate and multi-piece wiring substrate | ||
| 摘要 | A wiring substrate includes a substrate body formed of a plate-like ceramic, having a front surface, a back surface, and a height of 0.8 mm or less; a cavity opening at the front surface and having a rectangular shape as viewed in plane; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body. The wiring substrate further includes an electrically conductive layer having the form of a frame and formed on the front surface to surround an opening of the cavity; a ceramic surface having the form of a frame and located adjacently to the electrically conductive layer and along the outer periphery of the front surface; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface. | ||
| 申请公布号 | US9215802(B2) | 申请公布日期 | 2015.12.15 |
| 申请号 | US201214234604 | 申请日期 | 2012.12.25 |
| 申请人 | NGK SPARK PLUG CO., LTD. | 发明人 | Suzuki Jyun;Kito Naoki;Hasegawa Masami;Nakashima Chizuo |
| 分类号 | H05K1/00;H05K1/03;H05K3/00;H05K1/18;H05K3/40 | 主分类号 | H05K1/00 |
| 代理机构 | Stites & Harbison, PLLC | 代理人 | Stites & Harbison, PLLC ;Haeberlin Jeffrey A.;Hayne James R. |
| 主权项 | 1. A wiring substrate comprising: a substrate body formed of a plate-like ceramic, having a front surface and a back surface, and having a height between the front surface and the back surface of 0.8 mm or less; a cavity opening at the front surface of the substrate body; and side walls having a thickness of 0.3 mm or less between a side surface of the cavity and a side surface of the substrate body; the wiring substrate being characterized by further comprising: an electrically conductive layer having the form of a frame as viewed in plane and formed on the front surface of the substrate body in such a manner as to surround an opening of the cavity for receiving a frame-shaped member or a metal lid to be joined onto the electrically conductive layer; a ceramic surface having the form of a frame as viewed in plane and located adjacently to the electrically conductive layer and along an outer periphery of the front surface of the substrate body; and a via conductor formed in the substrate body along the side surface of the cavity between a bottom surface of the cavity and the front surface such that a portion thereof is exposed at the side surface of the cavity and such that one end thereof is connected to the electrically conductive layer. | ||
| 地址 | Nagoya JP | ||