Substrate processing method and substrate processing apparatus

摘要

According to one embodiment, a substrate processing method is disclosed. The method can include treating a substrate with a first liquid. The substrate has a structural body formed on a major surface of the substrate. The method can include forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid by carrying out at least one of causing the second liquid to react, reducing a quantity of a solvent included in the second liquid, and causing at least a portion of a substance dissolved in the second liquid to be separated. The method can include removing the support member by changing at least a part of the support member from a solid phase to a gaseous phase, without passing through a liquid phase.

主权项

1. A substrate processing method, comprising:
treating a substrate with a first liquid, the substrate having a structural body formed on at least a major surface of the substrate; forming a support member supporting the structural body by bringing a second liquid into contact with the substrate wetted by the first liquid, and changing at least a portion of the second liquid into a solid; and removing the support member by a sublimation of the support member from a solid phase directly to a gaseous phase by a simultaneous pressure reduction and heating process on the support member, wherein the heating process uses only a hot plate, wherein the support member includes a substance including at least one selected from the group consisting of a methacrylic resin material; a styrene resin material; a perfluoro group, iodine, naphthalene, and benzotriazole.