Electronic component and manufacturing method thereof

摘要

An electronic component includes a first conductor layer including a first conductor pattern P1, a first insulating layer covering the first conductor layer, a first opening h1 passing through the first insulting layer to expose top and side surfaces of the first conductor pattern P1 therethrough, and a second conductor layer formed on the first insulating layer and including a second conductor pattern P2 connected to the first conductor pattern P1 through the first opening h1. A first opening region which is a planar region inside the first opening h1 includes a first region in which the first conductor pattern P1 is formed and a second region in which the first conductor pattern P1 is not formed. The second conductor pattern P2 is embedded in both the first and second regions of the first opening h1.

主权项

1. An electronic component comprising:
a base insulating layer; a first conductor layer formed on a top surface of the base insulating layer and including a first conductor pattern; a first insulating layer covering the first conductor layer, the first insulating layer having a first opening passing therethrough to expose top and side surfaces of the first conductor pattern; and a second conductor layer formed on the first insulating layer and including a second conductor pattern in contact with the top and side surfaces of the first conductor pattern, wherein
the first opening surrounds a first opening region in a planar view, the first opening region including a first region where the first conductor pattern exists and a second region where the first conductor pattern does not exist,the top surface of the base insulting layer within at least the first opening region is flat, andthe second conductor pattern is embedded in both the first and second regions of the first opening region and in contact with the base insulating layer.