Semiconductor module having heat dissipating portion

摘要

A semiconductor module includes a control board, and a shield plate arranged opposing the control board. A metal first heat dissipating portion is provided on a surface of the control board. A metal second heat dissipating portion is provided on a first surface of the shield plate, opposing the surface of the control board. A dielectric body is arranged between the first heat dissipating portion and the second heat dissipating portion.

主权项

1. A semiconductor module comprising:
a control board having a surface; a shield plate arranged opposing the control board, the shield plate having a first surface opposing the surface of the control board, the surface of the control board and the first surface of the shield plate being parallel to each other; a first heat dissipating portion that is made of metal, the first heat dissipating portion being provided on the surface of the control board, the first heat dissipating portion having a plurality of first radiation fins, and the plurality of first radiation fins extending from the surface of the control board to the shield plate; a second heat dissipating portion that is made of metal, the second heat dissipating portion being provided on the first surface of the shield plate, the second heat dissipating portion having a plurality of second radiation fins, and the plurality of second radiation fins extending from the first surface of the shield plate toward the control board; and a dielectric body that is arranged between the first heat dissipating portion and the second heat dissipating portion, wherein the first radiation fins and the second radiation fins are alternately arranged in a direction parallel to the first surface.