HIGH TEMPERATURE CERAMIC DIE PACKAGE AND DUT BOARD SOCKET

摘要

A STRIP-SHAPED PACKAGE (105) IS PROVIDED THAT CAN ACCEPT A SINGLE DIE (102) UP TO MANY DICE (508A, 508B). CONDUCTION PATHS (104) ARE PRINTED (OR OTHERWISE INTEGRALLY FORMED) THEREON TO THE EDGE OF THE PACKAGE, AND A COMPLEMENTARY SOCKET (202) MAY BE PROVIDED THAT, IN COMBINATION WITH THE STRIP-SHAPED PACKAGE, PROVIDES FOR ELECTRICAL CONNECTION TO TEST ELECTRONICS WITHOUT THE USE OF PACKAGE LEADS (106). THE STRIP-SHAPED PACKAGE MAY BE MADE OF CERAMIC OR OTHER TEMPERATURE RESISTANT MATERIAL. THE STRIP-SHAPED PACKAGE MAY HAVE AT LEAST ONE ?WELL? LOCATION IN WHICH THE DIE OR DICE MAY BE AFFIXED TO THE STRIP-SHAPED PACKAGE. THE STRIP MAY HAVE NOTCHES CONFIGURED TO FUNCTION AS SEPARATORS (406A, 406B, ... 406N) BETWEEN THE INDIVIDUAL DIE HOUSINGS (AND RELATED INTEGRALLY-FORMED CONDUCTION PATHS).