| 发明名称 | Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition | ||
| 摘要 | The epoxy resin composition according to the present invention contains (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more:; | ||
| 申请公布号 | US9215803(B2) | 申请公布日期 | 2015.12.15 |
| 申请号 | US201113700561 | 申请日期 | 2011.05.31 |
| 申请人 | HITACHI CHEMICAL COMPANY, LTD. | 发明人 | Yanagida Makoto;Gouzu Shuuji |
| 分类号 | H05K1/03;C08G59/30;B32B15/08;B32B27/38;C08G59/08;C08G59/40;C08J5/24;B32B3/10;B32B15/092;C08L63/00;H05K3/02;C08K5/5313 | 主分类号 | H05K1/03 |
| 代理机构 | Fitch, Even, Tabin and Flannery LLP | 代理人 | Fitch, Even, Tabin and Flannery LLP |
| 主权项 | 1. An epoxy resin composition containing (A) a phosphorus-containing curing agent and (B) an epoxy resin, wherein the phosphorus-containing curing agent (A) is a phosphorus compound represented by the following Chemical Formula (1); an organic group represented by R in Chemical Formula (1) has at least one structure selected from structures represented by the following Chemical Formulas (2), (3) and (4) and has two or more phenolic hydroxyl groups; and the organic group has a molecular weight of 190 or more, wherein in Chemical Formulas (2), (3) and (4) * shows a part bonded directly to a phosphorus atom in Chemical Formula (1): | ||
| 地址 | Tokyo JP | ||