发明名称 Two-fluid nozzle and substrate liquid processing apparatus and substrate liquid processing method
摘要 A two-fluid nozzle 34 for spraying, toward a processing target object, droplets of a processing solution which are formed by mixing the processing solution discharged from a liquid discharge portion 48 and a gas discharged from a gas discharge opening 52 can uniformly spray the droplets of the processing solution having small diameters. Here, the liquid discharge portion 48 includes a multiple number of liquid discharge openings 47 arranged along a circle inside the gas discharge opening 52, and the multiple number of liquid discharge openings 47 discharge the processing solution in an outward direction of the circle.
申请公布号 US9214365(B2) 申请公布日期 2015.12.15
申请号 US201213529121 申请日期 2012.06.21
申请人 TOKYO ELECTRON LIMITED 发明人 Kai Yoshihiro;Kaneko Satoshi
分类号 H01L21/67 主分类号 H01L21/67
代理机构 Pearne & Gordon LLP 代理人 Pearne & Gordon LLP
主权项 1. A two-fluid nozzle for spraying, toward a processing target object, droplets of a processing solution which are formed by mixing the processing solution discharged from a liquid discharge portion and a gas discharged from a ring-shaped gas discharge opening formed on a lower surface of the two-fluid nozzle, wherein the liquid discharge portion includes a plurality of spaced liquid discharge openings arranged along a circle inside the ring-shaped gas discharge opening, the plurality of spaced liquid discharge openings are inclined relative to the lower surface and are fluidly coupled to a liquid inlet opening, each of the plurality of spaced liquid discharge openings being configured to obliquely discharge the processing solution in an outward direction toward the ring-shaped gas discharge opening, a distance between adjacent liquid discharge openings among the plurality of the liquid discharge openings is set to be a distance allowing processing solutions discharged from the respective liquid discharge openings not to contact each other in a region under the liquid discharge portion until the processing solution discharged from the respective liquid discharge openings collide with the gas, a distance between each of the liquid discharge openings and the ring-shaped gas discharge opening is set to be a distance allowing processing solutions discharged from adjacent liquid discharge openings to be mixed with the gas while not being contacted with each other, the ring-shaped gas discharge opening is configured to discharge the gas in a downward direction, and the liquid discharge openings and the ring-shaped gas discharge opening are positioned on the lower surface of the two-fluid nozzle facing the processing target object, such that the droplets of the processing solution are formed outside of the two-fluid nozzle.
地址 Tokyo JP