发明名称 |
Floor panel |
摘要 |
In a method for manufacturing floor panels that have at least a substrate and a top layer provided on the substrate, the top layer including a thermoplastic layer that is translucent or transparent, the method may involve providing the top layer, including the thermoplastic layer, on the substrate. The method may also involve heating at least the thermoplastic layer, and structuring the thermoplastic layer using a mechanical press element. |
申请公布号 |
US9212494(B2) |
申请公布日期 |
2015.12.15 |
申请号 |
US201414307645 |
申请日期 |
2014.06.18 |
申请人 |
FLOORING INDUSTRIES LIMITED, SARL |
发明人 |
Meersseman Laurent;Segaert Martin;Thiers Bernard;Clement Benjamin;Maesen Christophe |
分类号 |
E04B2/00;E04F15/10;B32B7/12;B32B21/02;B32B37/15;B32B37/22;B44C1/24;B44C5/04;B32B37/06;B32B37/16;B29C47/06;E04F15/18;E04F15/02;B32B38/00 |
主分类号 |
E04B2/00 |
代理机构 |
Capitol City TechLaw |
代理人 |
Capitol City TechLaw |
主权项 |
1. A floor panel comprising:
a substrate; a top layer provided on the substrate; wherein the substrate is a synthetic material board; wherein the top layer includes a back layer, a motif and a transparent wear layer; and wherein the back layer has a higher density than the transparent wear layer; and a backing layer provided on a lower side of the floor panel, the backing layer having a lower density than the back layer. |
地址 |
Bertrange LU |