发明名称 Gold plating solution
摘要 A gold plating bath and a plating method is disclosed where gold cyanide or salts thereof provide the source of gold, a cobalt compound, and a reaction product of compound containing at least a nitrogen-containing heterocyclic compound and an epihalohydrin. The gold plating bath has high deposition selectivity.
申请公布号 US9212429(B2) 申请公布日期 2015.12.15
申请号 US201113301942 申请日期 2011.11.22
申请人 发明人 Yomogida Koichi;Kondo Makoto
分类号 C25D3/56;C25D7/00;C23C28/02;C25D3/62 主分类号 C25D3/56
代理机构 代理人 Piskorski John J.
主权项 1. A gold cobalt alloy plating solution consisting of a gold cyanide or salt thereof, a cobalt compound, a conductive salt, water, a reaction product of a compound containing a nitrogen-containing heterocyclic compound, an epihalohydrin and an alkylene oxide, and optionally additives chosen from a chelating agent, and a pH adjusting agent.
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