发明名称 |
Nonvolatile semiconductor memory device and method of manufacturing the same |
摘要 |
According to one embodiment, a memory cell string stacked body includes first memory cell transistors above a semiconductor substrate, and second memory cell transistors below a first channel semiconductor film, and one of the first memory cell transistors and one of the second memory cell transistors share with a control gate electrode. The control gate electrodes of the first memory cell transistors cover an upper surface of a first charge storage layer and at least a part of a side surface in a second direction via a first insulating film in the one of the first memory cell transistors. The control gate electrodes of the second memory cell transistors cover only a lower surface of a second charge storage layer via a second insulating film in one of the second memory cell transistors. |
申请公布号 |
US9214234(B2) |
申请公布日期 |
2015.12.15 |
申请号 |
US201414150155 |
申请日期 |
2014.01.08 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Takekida Hideto |
分类号 |
H01L29/788;G11C16/04;G11C16/12;H01L27/115;H01L29/66 |
主分类号 |
H01L29/788 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A nonvolatile semiconductor memory device comprising a first memory cell string stacked body including a first memory cell string having first memory cell transistors serially connected in a first direction above a semiconductor substrate, and a second memory cell string having second memory cell transistors serially connected in the first direction below a first channel semiconductor film, and one of the first memory cell transistors and one of the second memory cell transistors sharing with a first control gate electrode,
wherein the first control gate electrode is formed so as to cover an upper surface of a first charge storage layer and at least a part of a side surface in a second direction intersecting the first direction via a first insulating film in the one of the first memory cell transistors, and the first control gate electrode is formed so as to cover only a lower surface of a second charge storage layer via a second insulating film in the one of the second memory cell transistors. |
地址 |
Minato-ku JP |