| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure which inhibits temperature rise of an electronic component generating heat with a simple structure.SOLUTION: A cooling structure includes: a base 12a provided at a vibrator 11 which mechanically vibrates; a circuit board 14 fixed to the base 12a, the circuit board 14 on which an electronic component 13, which generates heat, is mounted; a cover 12b which is fixed to the base 12a while covering the circuit board 14; and an elastic airflow generation member 15 which is attached to the base 12a so as to be separated from the circuit board 14 in the cover 12b, the elastic airflow generation member 15 which receives transmitted vibrations of the vibrator 11 and thereby vibrates to generate airflow in the cover 12b. |
