| 摘要 |
PROBLEM TO BE SOLVED: To enhance interlayer connection reliability while simplifying the manufacturing process, and to make the entirety thin and compact.SOLUTION: In a component built-in board having a multilayer structure formed by laminating a plurality of unit boards, and incorporating an electronic component, the plurality of unit boards includes a first board having a first wiring layer formed on at least one side of a first insulating layer and a first interlayer conductive layer penetrating the first insulating layer and connected with the first wiring layer, and provided with an opening housing the electronic component, and an intermediate board having a second insulating layer, a third insulating layer formed on the second insulating layer, a second wiring layer formed between the second and third insulating layers, a first adhesive layer provided on the surface layer of the second and third insulating layers, respectively, a second interlayer conductive layer penetrating the second insulating layer, together with the first adhesive layer, and connected with the second wiring layer, and a third interlayer conductive layer penetrating the third insulating layers, together with the first adhesive layer, and connected with the second wiring layer in a state where the central axis is different from the second interlayer conductive layer. The first wiring layer of the first board is connected with the second or third interlayer conductive layer of the intermediate board. |
