发明名称 ELECTRODE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electrode processing device capable of suppressing the scattering of cutting powder with a simple configuration, while understanding the deterioration state of the cut.SOLUTION: In an electrode processing device 1, an adhesive part 50 is arranged below the cutting position B on the opposite side of an air blowing section 30 while holding an electrode body S therebetween. Since air is blown from above the side of the electrode body S to the cutting powder produced at the cutting position B, and the cutting powder adheres to the adhesive part 50 below the cutting position B, scattering of the cutting powder can be suppressed with a simple configuration. Deterioration state of the cut 10 can be understood, by confirming the adhesion amount or adhesion state of the cutting powder adhering to the adhesive part 50.
申请公布号 JP2015225745(A) 申请公布日期 2015.12.14
申请号 JP20140108901 申请日期 2014.05.27
申请人 TOYOTA INDUSTRIES CORP 发明人 HIROE HIROSHI
分类号 H01M4/04;B23D19/00;B23D33/00;B23Q11/00;H01G13/00 主分类号 H01M4/04
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