| 摘要 |
PROBLEM TO BE SOLVED: To allow for handling a CAN package semiconductor laser different in outer shape or dimension by the same device or apparatus.SOLUTION: A jig 1 for handling a CAN package semiconductor laser including a semiconductor laser mounted on a pedestal, a cap applied to one side of the pedestal and covering the semiconductor laser, and a lead pin conducting with the semiconductor laser electrically, and projecting from the other side of the pedestal has a base 10 provided with a recess 20 in which the pedestal is fitted, a terminal pad 23 provided on the recess bottom surface 20b, and coming into contact with the lead pin, and a terminal pin 11 conducting with the terminal pad 23 electrically, and projecting from the base 10. |
