| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device inspection method capable of detecting a solder degradation that occurs to a semiconductor device with high sensitivity.SOLUTION: Provided is a method of inspecting a semiconductor device including a semiconductor switching element mounted on a substrate via a solder and a bonding wire connected to electrodes of the semiconductor switching element, comprises: a current-carrying step of carrying a current to the semiconductor switching element via the bonding wire connected at a predetermined position offset from a center of the electrodes of the semiconductor switching element; a calculating step of calculating a change amount of a gate threshold voltage of the semiconductor switching element when the current is carried for predetermined time; and a determining step of determining whether the solder degrades on the basis of the change amount of the gate threshold voltage. |
