| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder joint structure which allows for highly reliable connection, without using a special solder for aluminum, even when an aluminum plate is used as an electrode plate.SOLUTION: In a solder joint structure for solder joining one end of a lead wire 2 to a metallicon electrode 1a of a capacitor element 1, and solder joining the other end of the lead wire 2 to an electrode plate 4, the electrode plate 4 is an aluminum plate 4b subjected to Ni plating or Sn plating to at least one of the front surface or back surface. While inserting the other end of the lead wire 2 into a through hole 4c provided in the electrode plate 4, solder joining is performed by straddling the solder 3 across the outer peripheral surface of the lead wire 2 and the front or back surface of the electrode plate 4, without bringing into contact with a hole wall surface 4d constituting the through hole 4c. |
