| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that is excellent particularly in low shrinkage property, low thermal expansion property, high modulus of elasticity and desmear resistance property, and to provide a prepreg, film with resin, laminate sheet, multilayer printed circuit board and semiconductor package using the same.SOLUTION: Provided are: a thermosetting resin composition in which an epoxy resin having a naphthalene skeleton (A), an amino-modified siloxane compound having an aromatic azomethine group in the molecular structure (B), and a maleimide compound having at least two N-substituted maleimide groups in a molecule (C) are formulated; and a prepreg, film with resin, laminate sheet, multilayer printed circuit board and semiconductor package using the same. |
