| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wafer, which can prevent wafers from sticking to each other due to surface tension of a working fluid when the wafers are taken out from the working fluid, and which can prevent the wafer from being broken.SOLUTION: In a state in which a plurality of wafers W cut at an interval of a wire R are fixed in such a manner as to be juxtaposed on a base part 61, the wire R cut in to a support member 62, and the base part 61 are relatively cut out and fed in the thickness direction of the wafer W; the support member 62 is cut to separate the wafer W from the base part 61; and the separated wafer W is sunk and accommodated in a cage in a work tank. |
