| 摘要 |
PROBLEM TO BE SOLVED: To relax a stress due to thermal expansion and contraction of an electronic component built in a resin insulating layer, while achieving thinning of a printed wiring board.SOLUTION: On the first surface 11a side of a resin insulating layer 11, a first conductor pattern layer 12 including a first mounting pad group 12a and a second mounting pad group 12b for connection with a second electronic component 25 is formed, and on the second surface 11b of the resin insulating layer 11, a second conductor pattern layer 14 is formed so as to be connected with an external circuit. Between a first electronic component 20 and the first mounting pad group 12a, an adhesive layer 17 is interposed. First electrode 21 of the first electronic component 20 and the first mounting pad group 12a are connected by a first via conductor 15a. In this electronic component built-in printed wiring board 1, the first conductor pattern layer 12 including the first and second mounting pad groups 12a, 12b is embedded in the adhesive layer 17 and the resin insulating layer 11 on the first surface 11a side, while exposing one surface thereof. |
