| 摘要 |
PROBLEM TO BE SOLVED: To improve adhesiveness of a resin film that is obtained by using a photosensitive resin composition.SOLUTION: A photosensitive resin composition is provided, which comprises an alkali soluble resin, an organic silicon compound having a carboxyl group, a crosslinking agent, and an organic solvent. A DSC curve obtained by measuring a film formed from the above composition by drying at 80°C for 180 seconds to remove a volatile component, by use of a differential scanning calorimeter at a temperature elevation rate of 10°C/min satisfies the following conditions (a) and (b): (a) the curve has an exothermic peak in a temperature region of 80°C or higher and 120°C or lower; and (b) the heat quantity of the exothermic peak is 0.1 J/g or more and 10 J/g or less. |
