| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emission device and a manufacturing method for the same that can prevent melted solder from creeping to a semiconductor light emission element when the semiconductor light emission element is packaged, thereby packaging the semiconductor light emission element with high reliability.SOLUTION: A light emission device 100 has a semiconductor light emission element 1 having a semiconductor laminate 12 and electrodes 13, 15 provided on one surface, and a first resin layer 21 and a second resin layer 22 which are laminated at one surface side of the semiconductor laminate 12. The first resin layer 21 has first metal layers 31n, 31p connected to the electrodes 13, 15 therein, and the second resin layer 22 has second metal layers 32n, 32p connected to the first metal layers 31n, 31p therein. The upper surfaces of the second metal layers 32n, 32p are exposed from the second resin layer 22, and the side surface of the second resin layer 22 is provided to be located at the inside of the first resin layer 21 in plan view. |
