发明名称 ALKALI-SOLUBLE RESIN COMPOSITION AND PRINTED WIRING BOARD HAVING CURED FILM OF ALKALI-SOLUBLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an alkali-soluble resin composition excellent in set to touch property (tackiness), alkali developability and solder heat resistance.SOLUTION: There is provided an alkali-soluble resin composition containing (A) a resin having at least one (meth)acryloyl group and at least one carboxyl group in a molecule, (B) a photoinitiator and (C) a reactive diluent and the (A) is obtained by adding a compound represented by the following general formula (1), where Rrepresents a hydrogen atom, a linear or branched alkyl or aryl group having 1 to 8 carbon atoms, a carboxyl group or a hydroxyl group and m is an integer of 1 to 3, to a compound having at least one (meth)acryloyl group and at least one hydroxyl group in a molecule.
申请公布号 JP2015225249(A) 申请公布日期 2015.12.14
申请号 JP20140110495 申请日期 2014.05.28
申请人 TAMURA SEISAKUSHO CO LTD 发明人 TSUCHIYA MASAHIRO;KURAMOCHI MAYUKO;KITAMURA AKIRA
分类号 G03F7/027;C08F290/00;G03F7/038;H05K3/28 主分类号 G03F7/027
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