| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting element having a novel heat dissipation structure.SOLUTION: A light emitting element according to the present invention includes: a support member including a body, first and second pads separated from each other on the body, and a hole inside the body; a light emitting chip including a light emitting structure and third and fourth pads under the light emitting structure, the third and fourth pads being electrically connected to the first and second pads, respectively, and the light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; and an adhesive member disposed between the support member and the light emitting chip and including a projecting portion projecting to the inside of the hole. |
