| 摘要 |
PROBLEM TO BE SOLVED: To provide a shield case in which conduction of a board and a plating layer can be ensured, even if the plating layer becomes thin in the way.SOLUTION: A shield case (1) has an upper case (4), a board (7), a lower case (6), and a first nut embedded in the upper case (4), and fastening the upper case (4), the board (7), and the lower case (6). Upper surface of the upper case (4) is plated (5), a first nut (2) is composed of a conductive material, and is exposed to the upper surface of the upper case (4), and to the lower surface of the upper case (4), and conducting with the board ground (7A) of the board (7) housed in the shield case (1). |
